Upsiren 21W/mk 0.75/1.25/1.75mm GPU CPU Heatsink Cooling Conductive Silicone Pad High Quality Original Authentic Thermal Pad
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Specifications
- High-concerned chemical
- none
- Thermal Conductivity
- 21
- Dimension
- 100x100
- Type
- Thermal Pad
- Model Number
- OEM 21W/MK Thermal Pad
- Brand Name
- UPSIREN
- Origin
- Mainland China
- size
- 120x20mm,85x45
Description
21w/mk Thermal conductivity Thermal pad High quality 100X100mm CPU Heatsink Cooling Conductive Silicone Pad Thermal Pads
The Thermal pad support customization and wholesale, large quantity with preferential treatment
Main Features:
Specially developed for electronic products to solve the high temperature problem of frequency reduction, the material is soft and compressible, the product hardness reaches 30 degrees, soft and moderate can be compressed at will, can closely fit the chip, enhance the chip cooling efficiency, efficient cooling.
thermal pad has 21W/mK Thermal Conductivity, High temperature performance in -40 ℃ - 200 ℃ will not melt, Used to fill the gap between the heating element and the Heatsink, Achieve the best cooling effect,
thermal pad with good Insulation,Non-conductive, anti-static, wear-resistant, compression, buffering, fire-retardant, anti-corrosion,Non-toxic, odorless, no damage to metal materials, etc effect.
Applicable industry:
LED industry, automotive electronics industry, power industry, PDP/LED flat-panel TV, communications industry, Industrial industry, household electrical appliance industry.
Widely application for:
1: Electronic products, motherboard, motor, external pad and foot pad, electronic, appliances, high power LED lighting, Car machine.
2: Power devices, automotive electronic modules (engine scrubber) Power modules, high power power supplies.
3: Computer host (CPU, GPU, USICS, RDRAMTM, CD-ROM, IGPT module, hard drives), laptop and any electronic equipment needing to be filled with heat dissipation.
Why use thermal silicone Pad ?
1: The main purpose of the choice of Thermal Pad is to reduce the heat source surface and the heat dissipation device contact surface between the contact thermal resistance, Thermal conductivity of silicone Pad can be good filling the gap between the contact surface;
2: because the air is hot bad conductor, will seriously hinder the heat transfer between the contact surface,And in the heat source and the radiator between the installation of thermal silica Pad can be out of the air contact surface;
3: with thermal silicone Pad supplement, you can make the heat source and the heat sink between the contact surface better full contact,
4: Truly face to face contact in the temperature of the reaction can be achieved as small as possible temperature difference
